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Micromachined Fluidic Interconnect with deep reactive ion etching (DRIE) for precise interconnect capillaries


Stanford Reference:

95-086


Abstract


This patented invention makes use of deep reactive ion etching (DRIE) to fabricate extremely precise interconnects that allow for snug fits to capillaries. The DRIE process allows the fabrication of extremely high aspect ratio structures in silicon, to virtually any desired depth up to the entire wafer thickness. This allows the fabrication of extremely precise interconnect structures that have the exact shapes of the capillaries to which they are mated. The use of double-sided DRIE slows for the formation of sub-channels that match the inner diameter of the capillary and minimize dead volume in the interconnection (a key factor in system performance).

Applications


  • Microfluidics for:
    • gas chromatography
    • liquid chromatography
    • chip-scale synthesis and analysis
    • micro-scale refrigeration
    • mass-spectroscopy

Advantages


  • Allows for precise fitting of a capillary to an insertion channel
  • Allows for formation of subchannel having a diameter which precisely matches bore of capillary
  • Allows for interchanging of capillaries between insertion channels

Innovators & Portfolio



Patent Status



Date Released

 7/30/2013
 

Licensing Contact


Anne Kopf-Sill, Licensing Associate
(650)498-8015 (Business)
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Related Keywords


MEMS: micromachining   capillary   microfabrication   micromachined sensors   interconnects   MEMS: microfluidics   MEMS: MEMS    95-086   
 

   

  

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