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The Office of Technology Licensing was established in 1970 to transfer technologies developed at Stanford. Find out more about OTL's history, mission, staff, and statistics.

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Electrical Through-Wafer Interconnects


Stanford Reference:

01-234


Abstract

Electrical through-wafer interconnect is an efficient scheme to electrically address individual devices on different wafers for hybrid integration. By stacking of wafers, it provides vertical electrical through put for three-dimensional wafer level packaging, especially for micro-electro-mechanical-systems (MEMS) applications.

Applications


  • Micro-electro-mechanical-systems (MEMS), Ultrasonic transducers, Focal plane arrays, Coaxial cables, Micro fluid, Inkjet head, Integrated circuits, Micro array, Micro mirrors, Micro phones, Optical interconnects, Photo detectors, Piezo electrical and resistive materials, Pressure sensors, Wafer probes, Thermal expansion mismatch, Through-wafer transistors, Tunable mirrors, Vertical cavity surface emitting lasers (VCSELs), Wave guide.

Advantages


  • Small dimension, High density, Low parasitic resistance, Low parasitic capacitance, Low cost, High yield, Low cross talk.

Innovators & Portfolio



Patent Status



Date Released

 4/17/2002
 

Licensing Contact


Luis Mejia, Senior Licensing Associate
luis.mejia@stanford.edu
(650) 725-9409 (Direct)

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Related Keywords


MEMS: bioMEMS   imaging: ultrasound   cmut   transducers   imaging   semiconductor   imaging: acoustic   MEMS   
 

   

  

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