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Docket #: S03-235

Thermal Interface Materials

Applications

  • Promote heat flow from a heat-generating device to its cooling components
  • Release thermal expansion mismatch

Advantages

  • Higher thermal conductivity
  • Lower interface thermal resistance
  • Compatible usage with traditional thermal interface materials

Publications

  • Hu, X., Jiang, L., and Goodson, K.E., "Thermal Conductance Enhancement of Particle-Filled Thermal Interface Materials using Carbon Nanotube Inclusions", Thermal and Thermomechanical Phenomena in Electronic Systems, 1-4 June 2004, pages 63 - 69 Vol.1.

Web Site

Goodson Lab

Patents

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