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Docket #: S04-132

A Method for Heteroepitaxial Growth of Germanium on Silicon

Stanford researchers have patented a growth and anneal process for growing heteroepitaxial-germanium directly onto silicon. Low surface roughness and defects are confined near the Si/Ge interface, thus not threading to the surface as expected in this lattice mismatched system. This process creates defect-free, fully-relaxed, smooth, single crystal germanium layers on silicon without a graded buffer layer or any chemical-mechanical planarization. This technology simplifies heterogeneous integration of germanium CMOS and optoelectronic devices on silicon.

Applications

  • Ge MOSFETs with advanced high-K gate dielectric and metal gate integrated on Si Ge Photodetectors, Metal-Semiconductor-Metal (MSM) and p-i-n for optical interconnects
  • Ge based lasers integrated on Si
  • Bonding for Germanium on Insulator (GOI) fabrication and 3D applications
  • GaAs growth on CVD Ge for the eventual integration of Ge
  • Si and GaAs Ge/Si quantum well devices for DRAM, photonic and spintronic applications
  • Ge thin film photovoltaic devices
  • III-V on Si Tandem photovoltaic devices

Advantages

  • Simple, in-situ hydrogen anneal
  • No Chemical Mechanical Polishing (CMP) necessary
  • No thick SiGe Graded layer necessary
  • High purity epi-Ge achieved as compared to bulk germanium

Publications

Patents

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