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Method for Plating Fine Grain Copper Deposit over Stainless Steel


Stanford Reference:

13-384


Abstract


It is necessary to plate copper on stainless steel for various applications; however, it often remains difficult in practice to achieve the desired quality of the plated copper. A SLAC inventor has discovered an approach which provides excellent adherence and fine quality of copper plate to the base metal by using several different surface preparation, special electrolyte chemistry and pulse reverse power supply to adhere fine grain copper over substrate.

Applications


  • In many applications including brazing, heat transfer, ultra high vacuum operations, medical instruments as well as wave guides.

Advantages


  • Excellent adherence and fine quality of copper plate to the base metal.

Innovators & Portfolio



Date Released

 3/19/2014
 

Licensing Contact


Evan Elder, Licensing Associate
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[-] Map/Timeline

06-205 Precursor for Rapid Deposition of Strontium Oxide
06-281 Preparation of Azide-Modified Carbon Surfaces for Coupling to Various Species
08-142 Solution Sheared Deposition of Organic Semiconductor Thin-Films with Oriented Crystalline Morphology

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Related Keywords


Brazing operations   chemical: coating   chemical: electrochemistry   vacuum tube   
 

   

  

Also of Interest...
06-205 Precursor for Rapid Deposition of Strontium Oxide
06-281 Preparation of Azide-Modified Carbon Surfaces for Coupling to Various Species
08-142 Solution Sheared Deposition of Organic Semiconductor Thin-Films with Oriented Crystalline Morphology

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S13-384 Method for Plating Fine Grain Copper Deposit over Stainless Steel