Docket #: S03-235
Thermal Interface Materials
Applications
- Promote heat flow from a heat-generating device to its cooling components
- Release thermal expansion mismatch
Advantages
- Higher thermal conductivity
- Lower interface thermal resistance
- Compatible usage with traditional thermal interface materials
Publications
- Hu, X., Jiang, L., and Goodson, K.E., "Thermal Conductance Enhancement of Particle-Filled Thermal Interface Materials using Carbon Nanotube Inclusions", Thermal and Thermomechanical Phenomena in Electronic Systems, 1-4 June 2004, pages 63 - 69 Vol.1.
Web Site
Patents
- Published Application: 20050171269
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