Docket #: S06-203
Trench Isolated CMUT Arrays
Stanford researchers have developed a novel method of fabricating one-dimensional and two-dimensional capacitive micromachined ultrasonic transducer (CMUT) arrays. The method builds a CMUT array on a silicon-on-insulator (SOI) wafer using either the wafer-bonding method or the sacrificial release method. The electrical interconnect to CMUT array elements is provided through the highly conductive silicon substrate. A deep through-wafer trench provides isolation, and a frame structure provides mechanical support for the rigidity of the CMUT array.
Applications
- Fabrication of capacitative micromachined ultrasonic transducers (CMUT)
- Acoustic applications
- Ultrasonic imaging
- Microfluidics
Advantages
- Flexible arrays
Patents
- Published Application: 20080048211
- Issued: 7,741,686 (USA)
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