Researchers at the SLAC National Accelerator Laboratory have developed a cost-effective method for using low temperature microwave annealing to create diode termination contacts on silicon sensors.
Researchers in Stanford's Nanoscale Prototyping Laboratory have developed a simple, high throughput method to fabricate ultra-thin, defect-free, single crystal silicon sheets at a competitive cost.
Stanford researchers developed a strong, flexible, high heat transfer architecture for electronics packaging interfacial material. The resins currently used in electronics packaging are a thermal management bottleneck.