Researchers in the DeSimone Research Group have developed a high-resolution injection Continuous Liquid Interface Production (iCLIP) 3D printing process.
This invention is an efficient and very small high frequency inductor developed by Stanford researchers and made on an active substrate, such as silicon.
Stanford researchers at the Khuri-Yakub Lab have developed a new sensor topology that will enable high-resolution touch sensing and reliable authentication on portable electronics.
Stanford researchers developed a strong, flexible, high heat transfer architecture for electronics packaging interfacial material. The resins currently used in electronics packaging are a thermal management bottleneck.